I-PCB Circuit Board Fabrication Assembly OEM Manufacturer SMD/PTH Mounting With PCB&PCBA Inspection Egcwele
INGCACISO YOMKHIQIZO:
| I-Base Material: | I-FR4-TG140 | I-Surface Finish: | I-HASL(Lead Free) |
| Ubukhulu be-PCB: | 1.6mm | Imaski yeSolder: | Mnyama |
| Usayizi we-PCB: | 90*160mm | Isikrini sikasilika: | Emhlophe |
| Ukubalwa Kwesendlalelo: | 2/L | Cu Ubukhulu | 35um(1oz) |
| Uhlobo Lokukhweza: | I-SMT+DIP | Iphakheji ye-SMT | 0201,BGA,QFN |
| Isevisi yokuhlola | I-AOI, i-X-Ray, Ukuhlolwa Kokusebenza | Uhlobo lomhlinzeki | Imboni yokuhlanganisa |
I-TurnkeyAmasevisi:
1. Ukwenziwa kwe-PCB
2. I-Turnkey PCBA: I-PCB+components+SMT kanye ne- through-hole assembly+enclosure molding&housing
Umkhiqizo Oyinhloko:
Inzuzo yethu:
1, programming kanyeFukuhlolwa okungasebenzi
2, I-IPC-A-610E ejwayelekile, ukuhlolwa kwe-E, i-X-ray, ukuhlolwa kwe-AOI, i-QC, ubumnandi obungu-100%cukuhlolwa kwezwe.
3, Inkonzo yobungcweti.I-ISO SMT nangokuhlanganisa imbobo, isipiliyoni seminyaka eyi-10.
4,Isitifiketi: 94v-0, CE, SGS, FCC, RoHS, ISO9001:2008, ISO14001
5,Isikhathi sewaranti se-PCBA: iminyaka emi-2.
I-PCBA AMANDLA OKWENZA:
| Turnkey PCBA | PCB+components sourcing+assembly+package |
| Imininingwane yomhlangano | I-SMT kanye ne-Thru-hole, PCB ebiyelwe umhlangano |
| Isikhathi esiholayo | I-Prototype:10-12umsebenziingizinsuku.I-oda elikhulu:18~20nomainkosiizinsuku |
| Ukuhlola emikhiqizweni | Ukuhlolwa kwe-Flying Probe,Ukuhlolwa kwe-E,Ukuhlolwa kwe-X-ray, Ukuhlolwa kwe-AOI, ukuhlolwa okusebenzayo |
| Ubuningi | Inani elincane: 1pcs.I-prototype, ukuhleleka okuncane, ukuhleleka okukhulu |
| Amafayelauhlobo | I-PCB: Amafayela e-Gerber(CAM, PCB, PCBDOC) |
| Izingxenye: I-Bill of Materials(uhlu lwe-BOM) | |
| Umhlangano: Khetha&Faka ifayela, Umdwebo womhlangano | |
| PCB Panel Usayizi | Ubuncane bukasayizi: 0.25*0.25 amayintshi(6*6mm) |
| Ubukhulu besayizi: 20*20 amayintshi(500*500mm) | |
| Uhlobo lwe-PCB Solder | I-Water Soluble Solder Paste, i-RoHS ihola mahhala |
| Imininingwane yezingxenye | Dlula Kwehla kuya ku-01005usayizi |
| BGA kanyeI-QFN Ye-Chip | |
| I-SMT Assembly enamacala amabili | |
| I-Pitch Fine kuya ku-0.8mils | |
| Ukususwa kwengxenye kanye Nokushintshwa | |
| Iphakheji yengxenye | Sika I-Tape, I-Tube, Reels, Izingxenye Ezixekethile |
IKHONO LOKUQHUBEKA LE-PCB:
| 1 | Izendlalelo | 1-32Isendlalelo |
| 2 | Uhlobo lwezinto zebhodi | FR4,Cibhodi ye-eramic substrate,ibhodi le-aluminium, i-high-Tg, ama-Rogers nokuningi |
| 3 | I-lamination yezinto ezihlanganisiwe | Izendlalelo ezi-4 kuye kweziyisi-6 |
| 4 | Ubukhulu bobukhulu | 600 x1200mm |
| 5 | Ukumbozwa kokuqina kwebhodi | 0.2 kuya ku-6.00mm |
| 6 | Ububanzi bomugqa obuncane | 3mil |
| 7 | Ubuncane bendawo yomugqa | 3mil |
| 8 | Ugqinsi lwethusi lwesendlalelo sangaphandle | 8.75 ukuze 175µm |
| 9 | Ugqinsi lwethusi lwesendlalelo sangaphakathi | 17.5 kuya ku-175µm |
| 10 | Ububanzi bembobo yokubhoboza (umshini wokubhoboza) | 0.25 ukuze 6.00mm |
| 11 | I-diameter yembobo eqediwe (i-drill mechanical) | 0.20 ukuze 6.00mm |
| 12 | Ukubekezelelwa kobubanzi bembobo (umshini wokubhoboza) | 0.05mm |
| 13 | Ukubekezelela indawo yembobo (umshini wokubhoboza) | 0.075mm |
| 14 | Usayizi wembobo ye-laser | 0.10mm |
| 15 | Ukujiya kwebhodi kanye nesilinganiso sobubanzi bembobo | 10:1 |
| 16 | Uhlobo lwemaski ye-solder | Okuhlaza, Okuphuzi, Okumnyama, Okunsomi, Okuluhlaza okwesibhakabhaka, Okumhlophe nokubomvu |
| 17 | Ubuncane bemaski ye-solder | Ø0.10mm |
| 18 | Ubuncane bendandatho yokuhlukanisa imaski ye-solder | 0.05mm |
| 19 | I-solder mask uwoyela wepulaki ububanzi bembobo | 0.25 ukuze 0.60mm |
| 20 | Ukubekezelelana kokulawulwa kwe-Impedans | ±10% |
| 21 | Ukuqedwa kobuso | I-HASL(Lead Free), ENIG, isiliva lokucwiliswa, igolide plating, ithini lokucwiliswa kanye nomunwe wegolide |
Ukulethwa Okusheshayo:
PCBIn 12Amahora
I-PCBA ngezinsuku ezi-3
Isicelo Semikhiqizo Eyinhloko:
*Imikhiqizo Yezokwelapha
* Imikhiqizo Yezimoto
* Imikhiqizo yezimboni
* Imikhiqizo Yokuxhumana (AVL/GPS/GSM Amadivayisi)
* I-Electronics yabathengi.
Izinqubo Zomhlangano we-PCB:
* Ukuphathwa kohlelo
Amafayela e-PCB → DCC → Ukuhlela Uhlelo → Ukuthuthukisa → Ukuhlola
* Ukuphathwa kwe-SMT
I-PCB Loader → Iphrinta Yesikrini → Ihlola → Ukubekwa kwe-SMD → Ukuhlola → Ukugeleza komoya → Ukuhlolwa Kombono → I-AOI → Ukugcina
* Ukuphathwa kwe-PCBA
I-THT→I-Soldering Wave (I-Welding Manuwali) → Ukuhlolwa Kombono → I-ICT → I-Flash → FCT → Ukuhlola → Iphakheji → Ukuthunyelwa
I-PHILIFAST ikunikeza isipiliyoni esihle kakhulu sokukhiqiza ne-PCB
